%0 Journal Article %1 journals/mr/ChangLHHC15 %A Chang, Tao-Chih %A Lee, Chang-Chun %A Hsieh, Chia-Ping %A Hung, Sheng-Che %A Cheng, Ren-Shin %D 2015 %J Microelectron. Reliab. %K dblp %N 12 %P 2582-2588 %T Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology. %U http://dblp.uni-trier.de/db/journals/mr/mr55.html#ChangLHHC15 %V 55

@article{journals/mr/ChangLHHC15, added-at = {2020-02-22T00:00:00.000+0100}, author = {Chang, Tao-Chih and Lee, Chang-Chun and Hsieh, Chia-Ping and Hung, Sheng-Che and Cheng, Ren-Shin}, biburl = {https://www.bibsonomy.org/bibtex/297cb8332f81263227de90ed845261573/dblp}, ee = {https://doi.org/10.1016/j.microrel.2015.10.004}, interhash = {0da10f7ca01c1fc671250f1aceb35920}, intrahash = {97cb8332f81263227de90ed845261573}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 12, pages = {2582-2588}, timestamp = {2020-02-25T13:22:27.000+0100}, title = {Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#ChangLHHC15}, volume = 55, year = 2015 }