%0 Journal Article %1 journals/tie/GarciaWDTNDF16 %A Garcia, Andres %A Warner, Nathan %A D'Souza, Nandika Anne %A Tuncer, Enis %A Nguyen, Luu %A Denison, Marie %A Fong, Jeffrey T. %D 2016 %J IEEE Trans. Ind. Electron. %K dblp %N 11 %P 7104-7111 %T Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization. %U http://dblp.uni-trier.de/db/journals/tie/tie63.html#GarciaWDTNDF16 %V 63

@article{journals/tie/GarciaWDTNDF16, added-at = {2021-10-14T00:00:00.000+0200}, author = {Garcia, Andres and Warner, Nathan and D'Souza, Nandika Anne and Tuncer, Enis and Nguyen, Luu and Denison, Marie and Fong, Jeffrey T.}, biburl = {https://www.bibsonomy.org/bibtex/26357d45cf099c0df3575f30778986fa3/dblp}, ee = {https://doi.org/10.1109/TIE.2016.2585467}, interhash = {10f23b15e91dbe05fdb093878b9a4ea6}, intrahash = {6357d45cf099c0df3575f30778986fa3}, journal = {IEEE Trans. Ind. Electron.}, keywords = {dblp}, number = 11, pages = {7104-7111}, timestamp = {2024-04-08T10:29:45.000+0200}, title = {Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization.}, url = {http://dblp.uni-trier.de/db/journals/tie/tie63.html#GarciaWDTNDF16}, volume = 63, year = 2016 }