%0 Journal Article %1 journals/mr/VandeveldeIDLVGCGPWBT14 %A Vandevelde, Bart %A Ivankovic, Andrej %A Debecker, B. %A Lofrano, Melina %A Vanstreels, Kris %A Guo, Wei %A Cherman, Vladimir %A Gonzalez, Marcel %A der Plas, Geert Van %A Wolf, Ingrid De %A Beyne, Eric %A Tokei, Zsolt %D 2014 %J Microelectron. Reliab. %K %N 6-7 %P 1200-1205 %T Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#VandeveldeIDLVGCGPWBT14 %V 54

@article{journals/mr/VandeveldeIDLVGCGPWBT14, added-at = {2023-12-12T18:42:26.000+0100}, author = {Vandevelde, Bart and Ivankovic, Andrej and Debecker, B. and Lofrano, Melina and Vanstreels, Kris and Guo, Wei and Cherman, Vladimir and Gonzalez, Marcel and der Plas, Geert Van and Wolf, Ingrid De and Beyne, Eric and Tokei, Zsolt}, biburl = {https://www.bibsonomy.org/bibtex/29157da7e0ff0a2d828677636d7687b52/admin}, ee = {https://doi.org/10.1016/j.microrel.2014.02.026}, interhash = {161bb5a4fc25472e4b5bcac2fa0122ef}, intrahash = {9157da7e0ff0a2d828677636d7687b52}, journal = {Microelectron. Reliab.}, keywords = {}, number = {6-7}, pages = {1200-1205}, timestamp = {2023-12-12T18:42:26.000+0100}, title = {Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#VandeveldeIDLVGCGPWBT14}, volume = 54, year = 2014 }