%0 Conference Paper %1 conf/isqed/ZhangWT16 %A Zhang, Lang %A Wang, Hai %A Tan, Sheldon X.-D. %B ISQED %D 2016 %I IEEE %K dblp %P 173-178 %T Fast stress analysis for runtime reliability enhancement of 3D IC using artificial neural network. %U http://dblp.uni-trier.de/db/conf/isqed/isqed2016.html#ZhangWT16 %@ 978-1-5090-1213-8

@inproceedings{conf/isqed/ZhangWT16, added-at = {2018-02-20T00:00:00.000+0100}, author = {Zhang, Lang and Wang, Hai and Tan, Sheldon X.-D.}, biburl = {https://www.bibsonomy.org/bibtex/25108f11ec07b21c9778b92b2dae17007/dblp}, booktitle = {ISQED}, crossref = {conf/isqed/2016}, ee = {https://doi.org/10.1109/ISQED.2016.7479196}, interhash = {231a3fa2ca46d76433d8448c881ed6f7}, intrahash = {5108f11ec07b21c9778b92b2dae17007}, isbn = {978-1-5090-1213-8}, keywords = {dblp}, pages = {173-178}, publisher = {IEEE}, timestamp = {2018-02-21T11:42:33.000+0100}, title = {Fast stress analysis for runtime reliability enhancement of 3D IC using artificial neural network.}, url = {http://dblp.uni-trier.de/db/conf/isqed/isqed2016.html#ZhangWT16}, year = 2016 }