%0 Conference Paper %1 conf/3dic/VianneBFPCGFCEHT13 %A Vianne, Benjamin %A Bar, Pierre %A Fiori, Vincent %A Petitdidier, Sebastien %A Chevrier, Norbert %A Gallois-Garreignot, Sébastien %A Farcy, Alexis %A Chausse, Pascal %A Escoubas, Stephanie %A Hotellier, Nicolas %A Thomas, Olivier %B 3DIC %D 2013 %I IEEE %K dblp %P 1-7 %T Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#VianneBFPCGFCEHT13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/VianneBFPCGFCEHT13, added-at = {2017-05-21T00:00:00.000+0200}, author = {Vianne, Benjamin and Bar, Pierre and Fiori, Vincent and Petitdidier, Sebastien and Chevrier, Norbert and Gallois-Garreignot, Sébastien and Farcy, Alexis and Chausse, Pascal and Escoubas, Stephanie and Hotellier, Nicolas and Thomas, Olivier}, biburl = {https://www.bibsonomy.org/bibtex/2cc75ca1363d053c9c20465c200b8f331/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702332}, interhash = {25f8f61425dcae8ce6fbdec7ad9f7e48}, intrahash = {cc75ca1363d053c9c20465c200b8f331}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-7}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#VianneBFPCGFCEHT13}, year = 2013 }