%0 Journal Article %1 journals/mr/YingFS12 %A Ying, Wang %A Feng li, Ji %A Song song, Gao %D 2012 %J Microelectron. Reliab. %K dblp %N 11 %P 2856-2860 %T Finite element analysis of thermal stress for different Cu interconnects structure. %U http://dblp.uni-trier.de/db/journals/mr/mr52.html#YingFS12 %V 52

@article{journals/mr/YingFS12, added-at = {2020-02-22T00:00:00.000+0100}, author = {Ying, Wang and Feng li, Ji and Song song, Gao}, biburl = {https://www.bibsonomy.org/bibtex/2f6fcbaad9b4490059a99851a49cc9205/dblp}, ee = {https://doi.org/10.1016/j.microrel.2012.05.011}, interhash = {320e820c9ccb928faf579471e7f63291}, intrahash = {f6fcbaad9b4490059a99851a49cc9205}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 11, pages = {2856-2860}, timestamp = {2020-02-25T13:22:12.000+0100}, title = {Finite element analysis of thermal stress for different Cu interconnects structure.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr52.html#YingFS12}, volume = 52, year = 2012 }