%0 Conference Paper %1 conf/nems/XuW0FMJ13 %A Xu, Yichao %A Wang, Guanjiang %A Sun, Xin %A Fang, Runiu %A Miao, Min %A Jin, Yufeng %B NEMS %D 2013 %I IEEE %K dblp %P 233-236 %T In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging. %U http://dblp.uni-trier.de/db/conf/nems/nems2013.html#XuW0FMJ13

@inproceedings{conf/nems/XuW0FMJ13, added-at = {2017-05-17T00:00:00.000+0200}, author = {Xu, Yichao and Wang, Guanjiang and Sun, Xin and Fang, Runiu and Miao, Min and Jin, Yufeng}, biburl = {https://www.bibsonomy.org/bibtex/2329b795f866a4a4244c9a35c4fd4cc98/dblp}, booktitle = {NEMS}, crossref = {conf/nems/2013}, ee = {https://doi.org/10.1109/NEMS.2013.6559722}, interhash = {34c89176d8c6e334e1bc6ac1b020caf8}, intrahash = {329b795f866a4a4244c9a35c4fd4cc98}, keywords = {dblp}, pages = {233-236}, publisher = {IEEE}, timestamp = {2019-10-17T22:13:37.000+0200}, title = {In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging.}, url = {http://dblp.uni-trier.de/db/conf/nems/nems2013.html#XuW0FMJ13}, year = 2013 }