%0 Conference Paper %1 conf/3dic/GopeCACPC13 %A Gope, Dipanjan %A Chatterjee, S. %A de Araujo, D. %A Chakraborty, Swagato %A Pingenot, James %A Camposano, Raul %B 3DIC %D 2013 %I IEEE %K dblp %P 1-5 %T Device physics aware 3D electromagnetic simulation of Through-Silicon-Vias in system modeling. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#GopeCACPC13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/GopeCACPC13, added-at = {2023-06-13T00:00:00.000+0200}, author = {Gope, Dipanjan and Chatterjee, S. and de Araujo, D. and Chakraborty, Swagato and Pingenot, James and Camposano, Raul}, biburl = {https://www.bibsonomy.org/bibtex/239eb4c7a705516820115bc2e5ce14128/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702340}, interhash = {37d8613b49c8c6914328a182ce53871c}, intrahash = {39eb4c7a705516820115bc2e5ce14128}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:52.000+0200}, title = {Device physics aware 3D electromagnetic simulation of Through-Silicon-Vias in system modeling.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#GopeCACPC13}, year = 2013 }