%0 Conference Paper %1 conf/asicon/ChangCWCS11 %A Chang, Meng-Fan %A Chiu, Pi-Feng %A Wu, Wei-Cheng %A Chuang, Ching-Hao %A Sheu, Shyh-Shyuan %B ASICON %D 2011 %I IEEE %K dblp %P 299-302 %T Challenges and trends in low-power 3D die-stacked IC designs using RAM, memristor logic, and resistive memory (ReRAM). %U http://dblp.uni-trier.de/db/conf/asicon/asicon2011.html#ChangCWCS11 %@ 978-1-61284-192-2

@inproceedings{conf/asicon/ChangCWCS11, added-at = {2016-06-22T00:00:00.000+0200}, author = {Chang, Meng-Fan and Chiu, Pi-Feng and Wu, Wei-Cheng and Chuang, Ching-Hao and Sheu, Shyh-Shyuan}, biburl = {https://www.bibsonomy.org/bibtex/23053b178dd822be99c756e931f1e1ea2/dblp}, booktitle = {ASICON}, crossref = {conf/asicon/2011}, ee = {http://dx.doi.org/10.1109/ASICON.2011.6157181}, interhash = {3922d19076865236a622d620fb7ba512}, intrahash = {3053b178dd822be99c756e931f1e1ea2}, isbn = {978-1-61284-192-2}, keywords = {dblp}, pages = {299-302}, publisher = {IEEE}, timestamp = {2016-06-23T11:39:00.000+0200}, title = {Challenges and trends in low-power 3D die-stacked IC designs using RAM, memristor logic, and resistive memory (ReRAM).}, url = {http://dblp.uni-trier.de/db/conf/asicon/asicon2011.html#ChangCWCS11}, year = 2011 }