%0 Conference Paper %1 conf/3dic/TungCWKKA14 %A Tung, Bui Thanh %A Cheng, Xiaojin %A Watanabe, Naoya %A Kato, Fumiki %A Kikuchi, Katsuya %A Aoyagi, Masahiro %B 3DIC %D 2014 %I IEEE %K dblp %P 1-4 %T Copper filled TSV formation with Parylene-HT insulator for low-temperature compatible 3D integration. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#TungCWKKA14 %@ 978-1-4799-8472-5

@inproceedings{conf/3dic/TungCWKKA14, added-at = {2023-09-05T00:00:00.000+0200}, author = {Tung, Bui Thanh and Cheng, Xiaojin and Watanabe, Naoya and Kato, Fumiki and Kikuchi, Katsuya and Aoyagi, Masahiro}, biburl = {https://www.bibsonomy.org/bibtex/2247033ce2504215f169b340c9dbeed24/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2014}, ee = {https://doi.org/10.1109/3DIC.2014.7152162}, interhash = {392af27794de87596a890ec8b4d83730}, intrahash = {247033ce2504215f169b340c9dbeed24}, isbn = {978-1-4799-8472-5}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:53.000+0200}, title = {Copper filled TSV formation with Parylene-HT insulator for low-temperature compatible 3D integration.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#TungCWKKA14}, year = 2014 }