%0 Conference Paper %1 conf/smc/OhLHA04 %A Oh, Chang-Joon %A Lee, Young Joong %A Han, Young-Joon %A Ahn, Chung Sam %B SMC (5) %D 2004 %I IEEE %K dblp %P 4301-4305 %T A new system for reducing the bonding process cycle time and increasing the accuracy of bonding diagram. %U http://dblp.uni-trier.de/db/conf/smc/smc2004-5.html#OhLHA04 %@ 0-7803-8566-7

@inproceedings{conf/smc/OhLHA04, added-at = {2006-07-07T00:00:00.000+0200}, author = {Oh, Chang-Joon and Lee, Young Joong and Han, Young-Joon and Ahn, Chung Sam}, biburl = {https://www.bibsonomy.org/bibtex/28c44af6038f7f9023e1c39869128bd8f/dblp}, booktitle = {SMC (5)}, crossref = {conf/smc/2004}, ee = {http://dx.doi.org/10.1109/ICSMC.2004.1401207}, interhash = {3b9be082e40cc6552f47050edbb5a544}, intrahash = {8c44af6038f7f9023e1c39869128bd8f}, isbn = {0-7803-8566-7}, keywords = {dblp}, pages = {4301-4305}, publisher = {IEEE}, timestamp = {2013-08-13T14:54:22.000+0200}, title = {A new system for reducing the bonding process cycle time and increasing the accuracy of bonding diagram.}, url = {http://dblp.uni-trier.de/db/conf/smc/smc2004-5.html#OhLHA04}, year = 2004 }