%0 Journal Article %1 journals/mr/LiuSWTL12 %A Liu, Junchao %A Shi, Tielin %A Wang, Ke %A Tang, Zirong %A Liao, Guanglan %D 2012 %J Microelectron. Reliab. %K dblp %N 12 %P 3002-3010 %T Defect detection of flip-chip solder joints using modal analysis. %U http://dblp.uni-trier.de/db/journals/mr/mr52.html#LiuSWTL12 %V 52

@article{journals/mr/LiuSWTL12, added-at = {2020-02-22T00:00:00.000+0100}, author = {Liu, Junchao and Shi, Tielin and Wang, Ke and Tang, Zirong and Liao, Guanglan}, biburl = {https://www.bibsonomy.org/bibtex/2a92b72ff6c8af5acff0dd46ebc414f3b/dblp}, ee = {https://doi.org/10.1016/j.microrel.2012.06.135}, interhash = {4348503e90bdb9478e600346b100e8fe}, intrahash = {a92b72ff6c8af5acff0dd46ebc414f3b}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 12, pages = {3002-3010}, timestamp = {2020-02-25T13:27:02.000+0100}, title = {Defect detection of flip-chip solder joints using modal analysis.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr52.html#LiuSWTL12}, volume = 52, year = 2012 }