%0 Conference Paper %1 conf/3dic/MurayamaM15 %A Murayama, Takahide %A Morikawa, Yasuhiro %B 3DIC %D 2015 %I IEEE %K dblp %P TS8.11.1-TS8.11.4 %T TSV etching and VDP process integration for high reliability. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#MurayamaM15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/MurayamaM15, added-at = {2017-05-21T00:00:00.000+0200}, author = {Murayama, Takahide and Morikawa, Yasuhiro}, biburl = {https://www.bibsonomy.org/bibtex/27051894e0c26e641199298178ef97c7c/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334580}, interhash = {455bb31ba77ce4b01bdd18910ffd8b5c}, intrahash = {7051894e0c26e641199298178ef97c7c}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS8.11.1-TS8.11.4}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {TSV etching and VDP process integration for high reliability.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#MurayamaM15}, year = 2015 }