%0 Conference Paper %1 conf/3dic/InouePVVHST14 %A Inoue, Fumihiro %A Philipsen, Harold %A van der Veen, Marleen H. %A Vandersmissen, Kevin %A Huylenbroeck, Stefaan Van %A Struyf, Herbert %A Tanaka, Tetsu %B 3DIC %D 2014 %I IEEE %K dblp %P 1-4 %T Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#InouePVVHST14 %@ 978-1-4799-8472-5

@inproceedings{conf/3dic/InouePVVHST14, added-at = {2019-10-19T00:00:00.000+0200}, author = {Inoue, Fumihiro and Philipsen, Harold and van der Veen, Marleen H. and Vandersmissen, Kevin and Huylenbroeck, Stefaan Van and Struyf, Herbert and Tanaka, Tetsu}, biburl = {https://www.bibsonomy.org/bibtex/2caf36106707d4b343082c532e3ee94e0/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2014}, ee = {https://doi.org/10.1109/3DIC.2014.7152147}, interhash = {54ed153a19eb5966d77fa786a7c6b4d3}, intrahash = {caf36106707d4b343082c532e3ee94e0}, isbn = {978-1-4799-8472-5}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-22T16:17:17.000+0200}, title = {Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#InouePVVHST14}, year = 2014 }