%0 Journal Article %1 journals/mr/LukCH02 %A Luk, C. F. %A Chan, Y. C. %A Hung, K. C. %D 2002 %J Microelectron. Reliab. %K dblp %N 3 %P 381-389 %T Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. %U http://dblp.uni-trier.de/db/journals/mr/mr42.html#LukCH02 %V 42

@article{journals/mr/LukCH02, added-at = {2020-02-22T00:00:00.000+0100}, author = {Luk, C. F. and Chan, Y. C. and Hung, K. C.}, biburl = {https://www.bibsonomy.org/bibtex/233cfbf0454231c2fc068967f935e0b9e/dblp}, ee = {https://doi.org/10.1016/S0026-2714(01)00256-6}, interhash = {5c8ca7e29c493fbd8a6d88020fd45dbb}, intrahash = {33cfbf0454231c2fc068967f935e0b9e}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 3, pages = {381-389}, timestamp = {2020-02-25T13:26:56.000+0100}, title = {Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr42.html#LukCH02}, volume = 42, year = 2002 }