%0 Conference Paper %1 conf/3dic/ChengSUCCC15 %A Cheng, Chuan-An %A Sugie, Ryuichi %A Uchida, Tomoyuki %A Chen, Kou-Hua %A Chiu, Chi-Tsung %A Chen, Kuan-Neng %B 3DIC %D 2015 %I IEEE %K %P TS8.12.1-TS8.12.4 %T Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#ChengSUCCC15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/ChengSUCCC15, added-at = {2023-12-13T00:03:35.000+0100}, author = {Cheng, Chuan-An and Sugie, Ryuichi and Uchida, Tomoyuki and Chen, Kou-Hua and Chiu, Chi-Tsung and Chen, Kuan-Neng}, biburl = {https://www.bibsonomy.org/bibtex/24d66c86e6e51c0e3eb0279c723fe8677/admin}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334581}, interhash = {5e331928212000373959df0f97e87b51}, intrahash = {4d66c86e6e51c0e3eb0279c723fe8677}, isbn = {978-1-4673-9385-0}, keywords = {}, pages = {TS8.12.1-TS8.12.4}, publisher = {IEEE}, timestamp = {2023-12-13T00:03:35.000+0100}, title = {Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#ChengSUCCC15}, year = 2015 }