%0 Journal Article %1 journals/mr/ChanTLT16 %A Chan, Marvin %A Tan, Cher Ming %A Lee, Kheng Chooi %A Tan, Chuan Seng %D 2016 %J Microelectron. Reliab. %K dblp %P 56-63 %T Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation. %U http://dblp.uni-trier.de/db/journals/mr/mr61.html#ChanTLT16 %V 61

@article{journals/mr/ChanTLT16, added-at = {2021-10-14T00:00:00.000+0200}, author = {Chan, Marvin and Tan, Cher Ming and Lee, Kheng Chooi and Tan, Chuan Seng}, biburl = {https://www.bibsonomy.org/bibtex/2242f078e4bfc30f594e835f11d26e14e/dblp}, ee = {https://doi.org/10.1016/j.microrel.2015.12.026}, interhash = {5f4b5fda9125fc83fec76a19ea5f74d7}, intrahash = {242f078e4bfc30f594e835f11d26e14e}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {56-63}, timestamp = {2024-04-09T02:50:21.000+0200}, title = {Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr61.html#ChanTLT16}, volume = 61, year = 2016 }