%0 Journal Article %1 journals/mr/WongSDCOL09 %A Wong, Ee-Hua %A Seah, S. K. W. %A van Driel, W. D. %A Caers, J. F. J. M. %A Owens, N. %A Lai, Y.-S. %D 2009 %J Microelectron. Reliab. %K dblp %N 2 %P 139-149 %T Advances in the drop-impact reliability of solder joints for mobile applications. %U http://dblp.uni-trier.de/db/journals/mr/mr49.html#WongSDCOL09 %V 49

@article{journals/mr/WongSDCOL09, added-at = {2020-02-22T00:00:00.000+0100}, author = {Wong, Ee-Hua and Seah, S. K. W. and van Driel, W. D. and Caers, J. F. J. M. and Owens, N. and Lai, Y.-S.}, biburl = {https://www.bibsonomy.org/bibtex/25521a3576be9dc7634912d3e9e12448a/dblp}, ee = {https://doi.org/10.1016/j.microrel.2008.12.001}, interhash = {6bce272a49b4b7065d5e50af43cecf48}, intrahash = {5521a3576be9dc7634912d3e9e12448a}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 2, pages = {139-149}, timestamp = {2020-02-25T13:28:32.000+0100}, title = {Advances in the drop-impact reliability of solder joints for mobile applications.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr49.html#WongSDCOL09}, volume = 49, year = 2009 }