Inproceedings,
Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes.
C. Santos, P. Vivet, S. Thuries, O. Billoint, J. Colonna, P. Coudrain, and L. Wang.3DIC, page 1-5. IEEE, (2016)
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- conf/3dic/SantosVTBCCW16
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- inproceedings
- booktitle
- 3DIC
- year
- 2016
- pages
- 1-5
- publisher
- IEEE
- crossref
- conf/3dic/2016
- ee
- https://doi.org/10.1109/3DIC.2016.7970007
- isbn
- 978-1-5090-1399-9
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- http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#SantosVTBCCW16
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- please select -%0 Conference Paper
%1 conf/3dic/SantosVTBCCW16
%A Santos, Cristiano
%A Vivet, Pascal
%A Thuries, Sébastien
%A Billoint, Olivier
%A Colonna, Jean-Philippe
%A Coudrain, Perceval
%A Wang, Lee
%B 3DIC
%D 2016
%I IEEE
%K dblp
%P 1-5
%T Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#SantosVTBCCW16
%@ 978-1-5090-1399-9
@inproceedings{conf/3dic/SantosVTBCCW16,
added-at = {2022-06-17T00:00:00.000+0200},
author = {Santos, Cristiano and Vivet, Pascal and Thuries, Sébastien and Billoint, Olivier and Colonna, Jean-Philippe and Coudrain, Perceval and Wang, Lee},
biburl = {https://www.bibsonomy.org/bibtex/24db029feebfb822f129353182ff6a1a0/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2016},
ee = {https://doi.org/10.1109/3DIC.2016.7970007},
interhash = {6ebdf8dcaa7ab0b93c59534a8ae03198},
intrahash = {4db029feebfb822f129353182ff6a1a0},
isbn = {978-1-5090-1399-9},
keywords = {dblp},
pages = {1-5},
publisher = {IEEE},
timestamp = {2024-04-10T12:11:01.000+0200},
title = {Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#SantosVTBCCW16},
year = 2016
}