%0 Journal Article %1 journals/mr/ZhengLLWH03 %A Zheng, Po-Jen %A Lee, J. Z. %A Liu, K. H. %A Wu, J. D. %A Hung, S. C. %D 2003 %J Microelectron. Reliab. %K dblp %N 6 %P 925-934 %T Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls. %U http://dblp.uni-trier.de/db/journals/mr/mr43.html#ZhengLLWH03 %V 43

@article{journals/mr/ZhengLLWH03, added-at = {2020-02-22T00:00:00.000+0100}, author = {Zheng, Po-Jen and Lee, J. Z. and Liu, K. H. and Wu, J. D. and Hung, S. C.}, biburl = {https://www.bibsonomy.org/bibtex/2e3414b62e60d9c2a8da9281a3b9338d9/dblp}, ee = {https://doi.org/10.1016/S0026-2714(03)00072-6}, interhash = {6fa8a6efb6e8699bea0fc55129b89811}, intrahash = {e3414b62e60d9c2a8da9281a3b9338d9}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 6, pages = {925-934}, timestamp = {2020-02-25T13:23:40.000+0100}, title = {Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr43.html#ZhengLLWH03}, volume = 43, year = 2003 }