%0 Journal Article %1 journals/tie/XieSOLD24 %A Xie, Minghang %A Sun, Pengju %A Ouyang, Wenyuan %A Luo, Quanming %A Du, Xiong %D 2024 %J IEEE Trans. Ind. Electron. %K dblp %N 8 %P 9767-9776 %T Online Monitoring Bond Wires Fault of SiC MOSFETs With Kelvin Package Based on Turn-on Source Voltage Ringing. %U http://dblp.uni-trier.de/db/journals/tie/tie71.html#XieSOLD24 %V 71

@article{journals/tie/XieSOLD24, added-at = {2024-05-04T00:00:00.000+0200}, author = {Xie, Minghang and Sun, Pengju and Ouyang, Wenyuan and Luo, Quanming and Du, Xiong}, biburl = {https://www.bibsonomy.org/bibtex/2afdd7af2674596ae6dafe5754b405bdf/dblp}, ee = {https://doi.org/10.1109/TIE.2023.3329162}, interhash = {717db9df89d2ca28312ef11fce799575}, intrahash = {afdd7af2674596ae6dafe5754b405bdf}, journal = {IEEE Trans. Ind. Electron.}, keywords = {dblp}, month = {August}, number = 8, pages = {9767-9776}, timestamp = {2024-05-06T07:02:41.000+0200}, title = {Online Monitoring Bond Wires Fault of SiC MOSFETs With Kelvin Package Based on Turn-on Source Voltage Ringing.}, url = {http://dblp.uni-trier.de/db/journals/tie/tie71.html#XieSOLD24}, volume = 71, year = 2024 }