%0 Journal Article %1 journals/mr/GaoYCCLL18 %A Gao, Bing %A Yang, Fan %A Chen, Minyou %A Chen, Yigao %A Lai, Wei %A Liu, Chao %D 2018 %J Microelectron. Reliab. %K dblp %P 51-61 %T Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop. %U http://dblp.uni-trier.de/db/journals/mr/mr82.html#GaoYCCLL18 %V 82

@article{journals/mr/GaoYCCLL18, added-at = {2023-11-12T00:00:00.000+0100}, author = {Gao, Bing and Yang, Fan and Chen, Minyou and Chen, Yigao and Lai, Wei and Liu, Chao}, biburl = {https://www.bibsonomy.org/bibtex/223839ffa68ed4f784d6e8abcd522dcc7/dblp}, ee = {https://doi.org/10.1016/j.microrel.2017.12.046}, interhash = {9850d4bb4a077c2ce132bc2fb22d4bfd}, intrahash = {23839ffa68ed4f784d6e8abcd522dcc7}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {51-61}, timestamp = {2024-04-09T02:48:37.000+0200}, title = {Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr82.html#GaoYCCLL18}, volume = 82, year = 2018 }