%0 Conference Paper %1 conf/3dic/MurugesanHKFTK11 %A Murugesan, Mariappan %A Hashiguchi, Hideto %A Kobayashi, Harufumi %A Fukushima, Takafumi %A Tanaka, Tetsu %A Koyanagi, Mitsumasa %B 3DIC %D 2011 %E Koyanagi, Mitsumasa %E Kada, Morihiro %I IEEE %K dblp %P 1-4 %T W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#MurugesanHKFTK11 %@ 978-1-4673-2189-1

@inproceedings{conf/3dic/MurugesanHKFTK11, added-at = {2019-10-19T00:00:00.000+0200}, author = {Murugesan, Mariappan and Hashiguchi, Hideto and Kobayashi, Harufumi and Fukushima, Takafumi and Tanaka, Tetsu and Koyanagi, Mitsumasa}, biburl = {https://www.bibsonomy.org/bibtex/26f739f7bf855cd61c9b982098392e125/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2011}, editor = {Koyanagi, Mitsumasa and Kada, Morihiro}, ee = {https://doi.org/10.1109/3DIC.2012.6262970}, interhash = {9d5a17210c415db5b8b519b9470111ba}, intrahash = {6f739f7bf855cd61c9b982098392e125}, isbn = {978-1-4673-2189-1}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-22T16:17:21.000+0200}, title = {W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#MurugesanHKFTK11}, year = 2011 }