%0 Conference Paper %1 conf/3dic/SueokaHAKTMO15 %A Sueoka, Kuniaki %A Horibe, Akihiro %A Aoki, T. %A Kohara, Sayuri %A Toriyama, Kazushige %A Mori, Hiroyuki %A Orii, Yasumitsu %B 3DIC %D 2015 %I IEEE %K dblp %P TS8.3.1-TS8.3.5 %T Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#SueokaHAKTMO15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/SueokaHAKTMO15, added-at = {2017-05-21T00:00:00.000+0200}, author = {Sueoka, Kuniaki and Horibe, Akihiro and Aoki, T. and Kohara, Sayuri and Toriyama, Kazushige and Mori, Hiroyuki and Orii, Yasumitsu}, biburl = {https://www.bibsonomy.org/bibtex/28962f417893c054f2a43a5f19b7e1ede/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334608}, interhash = {9dc2362f6bb788592835d9c2deae4af6}, intrahash = {8962f417893c054f2a43a5f19b7e1ede}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS8.3.1-TS8.3.5}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#SueokaHAKTMO15}, year = 2015 }