%0 Journal Article %1 journals/mr/LaiWTJ07 %A Lai, Yi-Shao %A Wang, Tong Hong %A Tsai, Han-Hui %A Jen, Ming-Hwa R. %D 2007 %J Microelectron. Reliab. %K dblp %N 1 %P 111-117 %T Cyclic bending reliability of wafer-level chip-scale packages. %U http://dblp.uni-trier.de/db/journals/mr/mr47.html#LaiWTJ07 %V 47

@article{journals/mr/LaiWTJ07, added-at = {2020-02-22T00:00:00.000+0100}, author = {Lai, Yi-Shao and Wang, Tong Hong and Tsai, Han-Hui and Jen, Ming-Hwa R.}, biburl = {https://www.bibsonomy.org/bibtex/25f8a18727f7dfbf73667d13467c7cd00/dblp}, ee = {https://doi.org/10.1016/j.microrel.2006.04.010}, interhash = {9e075d6c2ea89e03c98cf1b43ddf43dc}, intrahash = {5f8a18727f7dfbf73667d13467c7cd00}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 1, pages = {111-117}, timestamp = {2020-02-25T13:25:59.000+0100}, title = {Cyclic bending reliability of wafer-level chip-scale packages.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr47.html#LaiWTJ07}, volume = 47, year = 2007 }