%0 Conference Paper %1 conf/3dic/CivaleMJFYWKRL13 %A Civale, Yann %A Meynen, Herman %A John, Ranjith S. E. %A Fu, Peng-Fei %A Yeakle, Craig R. %A Wang, Sheng %A Krausse, Stefan %A Rapps, Thomas %A Lutter, Stefan %B 3DIC %D 2013 %I IEEE %K dblp %P 1-5 %T Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#CivaleMJFYWKRL13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/CivaleMJFYWKRL13, added-at = {2017-05-21T00:00:00.000+0200}, author = {Civale, Yann and Meynen, Herman and John, Ranjith S. E. and Fu, Peng-Fei and Yeakle, Craig R. and Wang, Sheng and Krausse, Stefan and Rapps, Thomas and Lutter, Stefan}, biburl = {https://www.bibsonomy.org/bibtex/22a55c30372ef79535ec98eaa50e76b49/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702330}, interhash = {9e8dbaddd3e5ef5a5b6ff50aac5cf035}, intrahash = {2a55c30372ef79535ec98eaa50e76b49}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#CivaleMJFYWKRL13}, year = 2013 }