Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device.
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%0 Journal Article
%1 journals/mr/LeeBHW17
%A Lee, Hosung
%A Baeg, Sanghyeon
%A Hua, Nelson
%A Wen, Shi-Jie
%D 2017
%J Microelectron. Reliab.
%K dblp
%P 88-99
%T Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device.
%U http://dblp.uni-trier.de/db/journals/mr/mr69.html#LeeBHW17
%V 69
@article{journals/mr/LeeBHW17,
added-at = {2020-02-22T00:00:00.000+0100},
author = {Lee, Hosung and Baeg, Sanghyeon and Hua, Nelson and Wen, Shi-Jie},
biburl = {https://www.bibsonomy.org/bibtex/2af79b14842874511feb357658982f0b8/dblp},
ee = {https://doi.org/10.1016/j.microrel.2016.12.010},
interhash = {a1389b3bc226902577d5596da912acb8},
intrahash = {af79b14842874511feb357658982f0b8},
journal = {Microelectron. Reliab.},
keywords = {dblp},
pages = {88-99},
timestamp = {2020-02-25T13:23:40.000+0100},
title = {Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr69.html#LeeBHW17},
volume = 69,
year = 2017
}
