%0 Conference Paper %1 conf/3dic/MatsumotoISSKMOYFTK13 %A Matsumoto, Keiji %A Ibaraki, Soichiro %A Sueoka, Kuniaki %A Sakuma, Katsuyuki %A Kikuchi, Hidekazu %A Mori, Hiroyuki %A Orii, Yasumitsu %A Yamada, Fumiaki %A Fujihara, Kohei %A Takamatsu, Junichi %A Kondo, Koji %B 3DIC %D 2013 %I IEEE %K dblp %P 1-8 %T Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#MatsumotoISSKMOYFTK13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/MatsumotoISSKMOYFTK13, added-at = {2019-10-19T00:00:00.000+0200}, author = {Matsumoto, Keiji and Ibaraki, Soichiro and Sueoka, Kuniaki and Sakuma, Katsuyuki and Kikuchi, Hidekazu and Mori, Hiroyuki and Orii, Yasumitsu and Yamada, Fumiaki and Fujihara, Kohei and Takamatsu, Junichi and Kondo, Koji}, biburl = {https://www.bibsonomy.org/bibtex/2faa2c82930330e3b89923dc35d1b0f2d/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702329}, interhash = {ab91cd6154913f75e9bb4ff32c87ee66}, intrahash = {faa2c82930330e3b89923dc35d1b0f2d}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-8}, publisher = {IEEE}, timestamp = {2019-10-22T16:17:16.000+0200}, title = {Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#MatsumotoISSKMOYFTK13}, year = 2013 }