%0 Conference Paper %1 conf/3dic/DiengABGLJHFLF14 %A Dieng, Khadim %A Artillan, Philippe %A Bermond, Cédric %A Guiller, Olivier %A Lacrevaz, Thierry %A Joblot, Sylvain %A Houzet, Gregory %A Farcy, Alexis %A Lamy, Yann %A Fléchet, Bernard %B 3DIC %D 2014 %I IEEE %K dblp %P 1-8 %T Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#DiengABGLJHFLF14 %@ 978-1-4799-8472-5

@inproceedings{conf/3dic/DiengABGLJHFLF14, added-at = {2021-04-09T00:00:00.000+0200}, author = {Dieng, Khadim and Artillan, Philippe and Bermond, Cédric and Guiller, Olivier and Lacrevaz, Thierry and Joblot, Sylvain and Houzet, Gregory and Farcy, Alexis and Lamy, Yann and Fléchet, Bernard}, biburl = {https://www.bibsonomy.org/bibtex/2205b526e362d5ce9f117a69daa3a3528/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2014}, ee = {https://doi.org/10.1109/3DIC.2014.7152152}, interhash = {add3b8352532096fb37687a9234762c7}, intrahash = {205b526e362d5ce9f117a69daa3a3528}, isbn = {978-1-4799-8472-5}, keywords = {dblp}, pages = {1-8}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:53.000+0200}, title = {Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#DiengABGLJHFLF14}, year = 2014 }