%0 Journal Article %1 journals/mr/WangN14 %A Wang, Jianxin %A Nishikawa, Hiroshi %D 2014 %J Microelectron. Reliab. %K dblp %N 8 %P 1583-1591 %T Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#WangN14 %V 54

@article{journals/mr/WangN14, added-at = {2023-01-09T00:00:00.000+0100}, author = {Wang, Jianxin and Nishikawa, Hiroshi}, biburl = {https://www.bibsonomy.org/bibtex/2f144ee7d15b3eefaa657a340b6a3dcbf/dblp}, ee = {https://doi.org/10.1016/j.microrel.2014.03.007}, interhash = {b42cc9cc2fe6001ded866ea2299a96b6}, intrahash = {f144ee7d15b3eefaa657a340b6a3dcbf}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 8, pages = {1583-1591}, timestamp = {2024-04-09T02:49:51.000+0200}, title = {Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#WangN14}, volume = 54, year = 2014 }