%0 Conference Paper %1 conf/ddecs/LinHKW07 %A Lin, Rung-Bin %A Hsu, Da-Wei %A Kuo, Ming-Hsine %A Wu, Meng-Chiou %B DDECS %D 2007 %E Girard, Patrick %E Krasniewski, Andrzej %E Gramatová, Elena %E Pawlak, Adam %E Garbolino, Tomasz %I IEEE Computer Society %K dblp %P 341-344 %T Reticle Exposure Plans for Multi-Project Wafers. %U http://dblp.uni-trier.de/db/conf/ddecs/ddecs2007.html#LinHKW07 %@ 1-4244-1161-0

@inproceedings{conf/ddecs/LinHKW07, added-at = {2023-03-24T00:00:00.000+0100}, author = {Lin, Rung-Bin and Hsu, Da-Wei and Kuo, Ming-Hsine and Wu, Meng-Chiou}, biburl = {https://www.bibsonomy.org/bibtex/2bd44a5b028c7daf0a0b15b16bd5906f4/dblp}, booktitle = {DDECS}, crossref = {conf/ddecs/2007}, editor = {Girard, Patrick and Krasniewski, Andrzej and Gramatová, Elena and Pawlak, Adam and Garbolino, Tomasz}, ee = {https://doi.ieeecomputersociety.org/10.1109/DDECS.2007.4295308}, interhash = {b4fffe430a07ea4087ebe43d7d62ac87}, intrahash = {bd44a5b028c7daf0a0b15b16bd5906f4}, isbn = {1-4244-1161-0}, keywords = {dblp}, pages = {341-344}, publisher = {IEEE Computer Society}, timestamp = {2024-04-10T06:40:49.000+0200}, title = {Reticle Exposure Plans for Multi-Project Wafers.}, url = {http://dblp.uni-trier.de/db/conf/ddecs/ddecs2007.html#LinHKW07}, year = 2007 }