%0 Conference Paper %1 conf/itc/BordognaBPS22 %A Bordogna, Lorella %A Brembilla, Fabio %A Pagani, Alberto %A Spinetta, Marco %B ITC %D 2022 %I IEEE %K dblp %P 410-419 %T New R&R Methodology in Semiconductor Manufacturing Electrical Testing. %U http://dblp.uni-trier.de/db/conf/itc/itc2022.html#BordognaBPS22 %@ 978-1-6654-6270-9

@inproceedings{conf/itc/BordognaBPS22, added-at = {2023-01-05T00:00:00.000+0100}, author = {Bordogna, Lorella and Brembilla, Fabio and Pagani, Alberto and Spinetta, Marco}, biburl = {https://www.bibsonomy.org/bibtex/227313d9b18d8f51a79a85acb08c7314c/dblp}, booktitle = {ITC}, crossref = {conf/itc/2022}, ee = {https://doi.org/10.1109/ITC50671.2022.00048}, interhash = {b5998b0e8736daf35b25595c3a5b9c0b}, intrahash = {27313d9b18d8f51a79a85acb08c7314c}, isbn = {978-1-6654-6270-9}, keywords = {dblp}, pages = {410-419}, publisher = {IEEE}, timestamp = {2024-04-10T00:23:16.000+0200}, title = {New R&R Methodology in Semiconductor Manufacturing Electrical Testing.}, url = {http://dblp.uni-trier.de/db/conf/itc/itc2022.html#BordognaBPS22}, year = 2022 }