%0 Journal Article %1 journals/mr/HsuCYL11 %A Hsu, Hsiang-Chen %A Chang, Wei-Yao %A Yeh, Chang-Lin %A Lai, Yi-Shao %D 2011 %J Microelectron. Reliab. %K dblp %N 1 %P 179-186 %T Characteristic of copper wire and transient analysis on wirebonding process. %U http://dblp.uni-trier.de/db/journals/mr/mr51.html#HsuCYL11 %V 51

@article{journals/mr/HsuCYL11, added-at = {2020-02-22T00:00:00.000+0100}, author = {Hsu, Hsiang-Chen and Chang, Wei-Yao and Yeh, Chang-Lin and Lai, Yi-Shao}, biburl = {https://www.bibsonomy.org/bibtex/2efb8fb0434a3fe67ebe83b2577c974d3/dblp}, ee = {https://doi.org/10.1016/j.microrel.2010.11.008}, interhash = {b91d6841de3b1827e1c5047e95461a29}, intrahash = {efb8fb0434a3fe67ebe83b2577c974d3}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 1, pages = {179-186}, timestamp = {2020-02-25T13:25:23.000+0100}, title = {Characteristic of copper wire and transient analysis on wirebonding process.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr51.html#HsuCYL11}, volume = 51, year = 2011 }