%0 Conference Paper %1 conf/3dic/YamashitaKSHA15 %A Yamashita, Kosuke %A Kurooka, Shunji %A Shirakawa, Koji %A Hotta, Yoshinori %A Abe, Hirofumi %B 3DIC %D 2015 %I IEEE %K dblp %P TS8.1.1-TS8.1.5 %T Copper-filled anodized aluminum oxide a potential material for chip to chip bonding. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#YamashitaKSHA15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/YamashitaKSHA15, added-at = {2017-05-21T00:00:00.000+0200}, author = {Yamashita, Kosuke and Kurooka, Shunji and Shirakawa, Koji and Hotta, Yoshinori and Abe, Hirofumi}, biburl = {https://www.bibsonomy.org/bibtex/2bfd26df7164eb804392fd8b1a0e73789/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334589}, interhash = {1c98db3aecfb020edc194e5d536f5038}, intrahash = {bfd26df7164eb804392fd8b1a0e73789}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS8.1.1-TS8.1.5}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {Copper-filled anodized aluminum oxide a potential material for chip to chip bonding.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#YamashitaKSHA15}, year = 2015 }