%0 Journal Article %1 journals/mr/QinSHMMZ11 %A Qin, I. %A Shah, Aashish %A Huynh, C. %A Meyer, M. %A Mayer, M. %A Zhou, Norman Y. %D 2011 %J Microelectron. Reliab. %K dblp %N 1 %P 60-66 %T Role of process parameters on bondability and pad damage indicators in copper ball bonding. %U http://dblp.uni-trier.de/db/journals/mr/mr51.html#QinSHMMZ11 %V 51

@article{journals/mr/QinSHMMZ11, added-at = {2023-11-13T00:00:00.000+0100}, author = {Qin, I. and Shah, Aashish and Huynh, C. and Meyer, M. and Mayer, M. and Zhou, Norman Y.}, biburl = {https://www.bibsonomy.org/bibtex/26b45f9c9bb925634eb858206be44bb94/dblp}, ee = {https://doi.org/10.1016/j.microrel.2010.04.001}, interhash = {c9fed361dcb6f3349dd567936fa30967}, intrahash = {6b45f9c9bb925634eb858206be44bb94}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 1, pages = {60-66}, timestamp = {2024-04-09T02:49:20.000+0200}, title = {Role of process parameters on bondability and pad damage indicators in copper ball bonding.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr51.html#QinSHMMZ11}, volume = 51, year = 2011 }