%0 Conference Paper %1 conf/ps/TuLSC22 %A Tu, Jim-Han %A Liu, Chun-Nien %A Shih, Tien-Tsorng %A Cheng, Wood-Hi %B OECC/PSC %D 2022 %I IEEE %K dblp %P 1-4 %T Study of High Coupling Efficiency Cone Micro-Lensed Fiber Applied in Silicon Photonics Chip Packaging. %U http://dblp.uni-trier.de/db/conf/ps/psc2022.html#TuLSC22 %@ 978-4-88552-336-6

@inproceedings{conf/ps/TuLSC22, added-at = {2022-08-23T00:00:00.000+0200}, author = {Tu, Jim-Han and Liu, Chun-Nien and Shih, Tien-Tsorng and Cheng, Wood-Hi}, biburl = {https://www.bibsonomy.org/bibtex/2b410674f51d067f6ec6edda023ab6f86/dblp}, booktitle = {OECC/PSC}, crossref = {conf/ps/2022}, ee = {https://doi.org/10.23919/OECC/PSC53152.2022.9850128}, interhash = {cbadefaa920c64b1abdbe7a928d17e1d}, intrahash = {b410674f51d067f6ec6edda023ab6f86}, isbn = {978-4-88552-336-6}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-09T19:35:56.000+0200}, title = {Study of High Coupling Efficiency Cone Micro-Lensed Fiber Applied in Silicon Photonics Chip Packaging.}, url = {http://dblp.uni-trier.de/db/conf/ps/psc2022.html#TuLSC22}, year = 2022 }