%0 Conference Paper %1 conf/iccad/LinLC16 %A Lin, Bo-Qiao %A Lin, Ting-Chou %A Chang, Yao-Wen %B ICCAD %D 2016 %E Liu, Frank %I ACM %K dblp %P 23 %T Redistribution layer routing for integrated fan-out wafer-level chip-scale packages. %U http://dblp.uni-trier.de/db/conf/iccad/iccad2016.html#LinLC16 %@ 978-1-4503-4466-1

@inproceedings{conf/iccad/LinLC16, added-at = {2018-11-06T00:00:00.000+0100}, author = {Lin, Bo-Qiao and Lin, Ting-Chou and Chang, Yao-Wen}, biburl = {https://www.bibsonomy.org/bibtex/214ca43469691844771c777b1ef11a98b/dblp}, booktitle = {ICCAD}, crossref = {conf/iccad/2016}, editor = {Liu, Frank}, ee = {https://doi.org/10.1145/2966986.2967070}, interhash = {cea6ada7bd3f693b338a1bfdb752c36a}, intrahash = {14ca43469691844771c777b1ef11a98b}, isbn = {978-1-4503-4466-1}, keywords = {dblp}, pages = 23, publisher = {ACM}, timestamp = {2024-04-09T19:27:49.000+0200}, title = {Redistribution layer routing for integrated fan-out wafer-level chip-scale packages.}, url = {http://dblp.uni-trier.de/db/conf/iccad/iccad2016.html#LinLC16}, year = 2016 }