Inproceedings,
3D memory chip stacking by multi-layer self-assembly technology.
T. Fukushima, J. Bea, M. Murugesan, H. Son, M. Suh, K. Byun, N. Kim, K. Lee, and M. Koyanagi.3DIC, page 1-4. IEEE, (2013)
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- conf/3dic/FukushimaBMSSBKLK13
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- inproceedings
- booktitle
- 3DIC
- year
- 2013
- pages
- 1-4
- publisher
- IEEE
- crossref
- conf/3dic/2013
- ee
- https://doi.org/10.1109/3DIC.2013.6702360
- isbn
- 978-1-4673-6484-3
- url
- http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#FukushimaBMSSBKLK13
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%1 conf/3dic/FukushimaBMSSBKLK13
%A Fukushima, Takafumi
%A Bea, Jichoel
%A Murugesan, Mariappan
%A Son, Ho-Young
%A Suh, M.-S.
%A Byun, K.-Y.
%A Kim, N.-S.
%A Lee, Kang Wook
%A Koyanagi, Mitsumasa
%B 3DIC
%D 2013
%I IEEE
%K dblp
%P 1-4
%T 3D memory chip stacking by multi-layer self-assembly technology.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#FukushimaBMSSBKLK13
%@ 978-1-4673-6484-3
@inproceedings{conf/3dic/FukushimaBMSSBKLK13,
added-at = {2021-02-16T00:00:00.000+0100},
author = {Fukushima, Takafumi and Bea, Jichoel and Murugesan, Mariappan and Son, Ho-Young and Suh, M.-S. and Byun, K.-Y. and Kim, N.-S. and Lee, Kang Wook and Koyanagi, Mitsumasa},
biburl = {https://www.bibsonomy.org/bibtex/2534760e2f586295d80dd6d3c3babace6/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2013},
ee = {https://doi.org/10.1109/3DIC.2013.6702360},
interhash = {d55c71d54d860747a239ff67e1828cc1},
intrahash = {534760e2f586295d80dd6d3c3babace6},
isbn = {978-1-4673-6484-3},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2024-04-10T12:10:52.000+0200},
title = {3D memory chip stacking by multi-layer self-assembly technology.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#FukushimaBMSSBKLK13},
year = 2013
}