Please log in to take part in the discussion (add own reviews or comments).
Cite this publication
More citation styles
- please select -
%0 Conference Paper
%1 conf/irps/HaLBLKWLLP23
%A Ha, Sungmock
%A Lee, S.
%A Bae, G. H.
%A Lee, D. S.
%A Kim, S. H.
%A Woo, B. W.
%A Lee, N.-H.
%A Lee, Y. S.
%A Pae, S.
%B IRPS
%D 2023
%I IEEE
%K dblp
%P 1-7
%T Reliability Characterization of HBM featuring $HK+MG$ Logic Chip with Multi-stacked DRAMs.
%U http://dblp.uni-trier.de/db/conf/irps/irps2023.html#HaLBLKWLLP23
%@ 978-1-6654-5672-2
@inproceedings{conf/irps/HaLBLKWLLP23,
added-at = {2023-05-24T00:00:00.000+0200},
author = {Ha, Sungmock and Lee, S. and Bae, G. H. and Lee, D. S. and Kim, S. H. and Woo, B. W. and Lee, N.-H. and Lee, Y. S. and Pae, S.},
biburl = {https://www.bibsonomy.org/bibtex/2f900d6c8605a97071048158d382e737e/dblp},
booktitle = {IRPS},
crossref = {conf/irps/2023},
ee = {https://doi.org/10.1109/IRPS48203.2023.10118277},
interhash = {dbdaaea78b08b2937fb9d7944e5ccff4},
intrahash = {f900d6c8605a97071048158d382e737e},
isbn = {978-1-6654-5672-2},
keywords = {dblp},
pages = {1-7},
publisher = {IEEE},
timestamp = {2024-04-09T12:18:52.000+0200},
title = {Reliability Characterization of HBM featuring $\text{HK}+\text{MG}$ Logic Chip with Multi-stacked DRAMs.},
url = {http://dblp.uni-trier.de/db/conf/irps/irps2023.html#HaLBLKWLLP23},
year = 2023
}