%0 Journal Article %1 journals/access/TsaiCCC16 %A Tsai, Jinn-Tsong %A Chang, Cheng-Chung %A Chen, Wen-Ping %A Chou, Jyh-Horng %D 2016 %J IEEE Access %K dblp %P 3034-3045 %T Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method. %U http://dblp.uni-trier.de/db/journals/access/access4.html#TsaiCCC16 %V 4

@article{journals/access/TsaiCCC16, added-at = {2018-07-04T00:00:00.000+0200}, author = {Tsai, Jinn-Tsong and Chang, Cheng-Chung and Chen, Wen-Ping and Chou, Jyh-Horng}, biburl = {https://www.bibsonomy.org/bibtex/2079dda4d6fc818eedcb14e4a668249b4/dblp}, ee = {https://doi.org/10.1109/ACCESS.2016.2581258}, interhash = {dc6ffc0f2b43397040d871b0591bcbcd}, intrahash = {079dda4d6fc818eedcb14e4a668249b4}, journal = {IEEE Access}, keywords = {dblp}, pages = {3034-3045}, timestamp = {2018-07-05T11:38:06.000+0200}, title = {Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method.}, url = {http://dblp.uni-trier.de/db/journals/access/access4.html#TsaiCCC16}, volume = 4, year = 2016 }