%0 Conference Paper %1 conf/nems/NieSTLL09 %A Nie, Lei %A Shi, Tielin %A Tang, Zirong %A Liu, Shiyuan %A Liao, Guanglan %B NEMS %D 2009 %I IEEE Computer Society %K dblp %P 472-475 %T Low temperature direct bonding for hermetic wafer level packaging. %U http://dblp.uni-trier.de/db/conf/nems/nems2009.html#NieSTLL09 %@ 978-1-4244-4629-2

@inproceedings{conf/nems/NieSTLL09, added-at = {2023-03-23T00:00:00.000+0100}, author = {Nie, Lei and Shi, Tielin and Tang, Zirong and Liu, Shiyuan and Liao, Guanglan}, biburl = {https://www.bibsonomy.org/bibtex/2c706113631aab977fbfe93ff95221918/dblp}, booktitle = {NEMS}, crossref = {conf/nems/2009}, ee = {https://doi.ieeecomputersociety.org/10.1109/NEMS.2009.5068621}, interhash = {de749899e1106d744589272a44482495}, intrahash = {c706113631aab977fbfe93ff95221918}, isbn = {978-1-4244-4629-2}, keywords = {dblp}, pages = {472-475}, publisher = {IEEE Computer Society}, timestamp = {2024-04-10T19:56:10.000+0200}, title = {Low temperature direct bonding for hermetic wafer level packaging.}, url = {http://dblp.uni-trier.de/db/conf/nems/nems2009.html#NieSTLL09}, year = 2009 }