%0 Journal Article %1 journals/tvlsi/QiuMM15 %A Qiu, Xiang %A Marek-Sadowska, Malgorzata %A Maly, Wojciech P. %D 2015 %J IEEE Trans. Very Large Scale Integr. Syst. %K dblp %N 5 %P 869-878 %T Three-Dimensional Chips Can Be Cool: Thermal Study of VeSFET-Based 3-D Chips. %U http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi23.html#QiuMM15 %V 23

@article{journals/tvlsi/QiuMM15, added-at = {2020-03-11T00:00:00.000+0100}, author = {Qiu, Xiang and Marek-Sadowska, Malgorzata and Maly, Wojciech P.}, biburl = {https://www.bibsonomy.org/bibtex/2ab482f18323d1ecefa67ea0830812021/dblp}, ee = {https://doi.org/10.1109/TVLSI.2014.2325551}, interhash = {e2b5dd7108646269dd424d78991051e0}, intrahash = {ab482f18323d1ecefa67ea0830812021}, journal = {IEEE Trans. Very Large Scale Integr. Syst.}, keywords = {dblp}, number = 5, pages = {869-878}, timestamp = {2020-03-12T11:43:45.000+0100}, title = {Three-Dimensional Chips Can Be Cool: Thermal Study of VeSFET-Based 3-D Chips.}, url = {http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi23.html#QiuMM15}, volume = 23, year = 2015 }