%0 Journal Article %1 journals/mr/WangJRP14 %A Wang, Xi-Shu %A Jia, Su %A Ren, Huai-Hui %A Pan, Pan %D 2014 %J Microelectron. Reliab. %K dblp %N 3 %P 633-640 %T Effects of solder balls and arrays on the failure behavior in Package-on-Package structure. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#WangJRP14 %V 54

@article{journals/mr/WangJRP14, added-at = {2020-02-22T00:00:00.000+0100}, author = {Wang, Xi-Shu and Jia, Su and Ren, Huai-Hui and Pan, Pan}, biburl = {https://www.bibsonomy.org/bibtex/2b0736e8c8e917cdf03179d1cc872a911/dblp}, ee = {https://doi.org/10.1016/j.microrel.2013.11.012}, interhash = {e6ad9043f7f83c1645c7210161250acb}, intrahash = {b0736e8c8e917cdf03179d1cc872a911}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 3, pages = {633-640}, timestamp = {2020-02-25T13:23:40.000+0100}, title = {Effects of solder balls and arrays on the failure behavior in Package-on-Package structure.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#WangJRP14}, volume = 54, year = 2014 }