Inproceedings,
Power, Performance, and Thermal Trade-offs in M3D-enabled Manycore Chips.
S. Musavvir, A. Chatterjee, R. Kim, D. Kim, J. Doppa, and P. Pande.DATE, page 1752-1757. IEEE, (2020)
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- conf/date/MusavvirCKKDP20
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- inproceedings
- booktitle
- DATE
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- 2020
- pages
- 1752-1757
- publisher
- IEEE
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- conf/date/2020
- ee
- https://doi.org/10.23919/DATE48585.2020.9116345
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- 978-3-9819263-4-7
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- http://dblp.uni-trier.de/db/conf/date/date2020.html#MusavvirCKKDP20
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%1 conf/date/MusavvirCKKDP20
%A Musavvir, Shouvik
%A Chatterjee, Anwesha
%A Kim, Ryan Gary
%A Kim, Dae Hyun
%A Doppa, Janardhan Rao
%A Pande, Partha Pratim
%B DATE
%D 2020
%I IEEE
%K dblp
%P 1752-1757
%T Power, Performance, and Thermal Trade-offs in M3D-enabled Manycore Chips.
%U http://dblp.uni-trier.de/db/conf/date/date2020.html#MusavvirCKKDP20
%@ 978-3-9819263-4-7
@inproceedings{conf/date/MusavvirCKKDP20,
added-at = {2022-04-15T00:00:00.000+0200},
author = {Musavvir, Shouvik and Chatterjee, Anwesha and Kim, Ryan Gary and Kim, Dae Hyun and Doppa, Janardhan Rao and Pande, Partha Pratim},
biburl = {https://www.bibsonomy.org/bibtex/24122e452436e274a5a8d518627356694/dblp},
booktitle = {DATE},
crossref = {conf/date/2020},
ee = {https://doi.org/10.23919/DATE48585.2020.9116345},
interhash = {e7e5ef7d00dd776f23db56e6cca06648},
intrahash = {4122e452436e274a5a8d518627356694},
isbn = {978-3-9819263-4-7},
keywords = {dblp},
pages = {1752-1757},
publisher = {IEEE},
timestamp = {2024-04-10T06:46:25.000+0200},
title = {Power, Performance, and Thermal Trade-offs in M3D-enabled Manycore Chips.},
url = {http://dblp.uni-trier.de/db/conf/date/date2020.html#MusavvirCKKDP20},
year = 2020
}