%0 Journal Article %1 journals/todaes/YuHH09 %A Yu, Hao %A Ho, Joanna %A He, Lei %D 2009 %J ACM Trans. Design Autom. Electr. Syst. %K dblp %N 3 %P 41:1-41:31 %T Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity. %U http://dblp.uni-trier.de/db/journals/todaes/todaes14.html#YuHH09 %V 14

@article{journals/todaes/YuHH09, added-at = {2018-11-06T00:00:00.000+0100}, author = {Yu, Hao and Ho, Joanna and He, Lei}, biburl = {https://www.bibsonomy.org/bibtex/21ca1bec26388e9ae907b45c945d805c1/dblp}, ee = {https://doi.org/10.1145/1529255.1529263}, interhash = {e902b0e7da478687b871c635b48b8bf7}, intrahash = {1ca1bec26388e9ae907b45c945d805c1}, journal = {ACM Trans. Design Autom. Electr. Syst.}, keywords = {dblp}, number = 3, pages = {41:1-41:31}, timestamp = {2018-11-07T12:23:44.000+0100}, title = {Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity.}, url = {http://dblp.uni-trier.de/db/journals/todaes/todaes14.html#YuHH09}, volume = 14, year = 2009 }