%0 Journal Article %1 journals/mr/Dietrich14 %A Dietrich, Peter %D 2014 %J Microelectron. Reliab. %K dblp %N 9-10 %P 1901-1905 %T Joining and package technology for 175 °C Tj increasing reliability in automotive applications. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#Dietrich14 %V 54

@article{journals/mr/Dietrich14, added-at = {2020-02-22T00:00:00.000+0100}, author = {Dietrich, Peter}, biburl = {https://www.bibsonomy.org/bibtex/2862a7955dc4c86856af9d48506ae3bd8/dblp}, ee = {https://doi.org/10.1016/j.microrel.2014.08.007}, interhash = {e9aab6b7fee0282071b81458d770d610}, intrahash = {862a7955dc4c86856af9d48506ae3bd8}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = {9-10}, pages = {1901-1905}, timestamp = {2020-02-25T13:25:51.000+0100}, title = {Joining and package technology for 175 °C Tj increasing reliability in automotive applications.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#Dietrich14}, volume = 54, year = 2014 }