Inproceedings,
High productivity thermal compression bonding for 3D-IC.
N. Asahi, Y. Miyamoto, M. Nimura, Y. Mizutani, and Y. Arai.3DIC, page TS7.3.1-TS7.3.5. IEEE, (2015)
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- BibTeX key
- conf/3dic/AsahiMNMA15
- entry type
- inproceedings
- booktitle
- 3DIC
- year
- 2015
- pages
- TS7.3.1-TS7.3.5
- publisher
- IEEE
- crossref
- conf/3dic/2015
- ee
- https://doi.org/10.1109/3DIC.2015.7334577
- isbn
- 978-1-4673-9385-0
- url
- http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#AsahiMNMA15
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%1 conf/3dic/AsahiMNMA15
%A Asahi, Noboru
%A Miyamoto, Yoshinori
%A Nimura, Masatsugu
%A Mizutani, Yoshihito
%A Arai, Yoshiyuki
%B 3DIC
%D 2015
%I IEEE
%K dblp
%P TS7.3.1-TS7.3.5
%T High productivity thermal compression bonding for 3D-IC.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#AsahiMNMA15
%@ 978-1-4673-9385-0
@inproceedings{conf/3dic/AsahiMNMA15,
added-at = {2017-05-21T00:00:00.000+0200},
author = {Asahi, Noboru and Miyamoto, Yoshinori and Nimura, Masatsugu and Mizutani, Yoshihito and Arai, Yoshiyuki},
biburl = {https://www.bibsonomy.org/bibtex/2ed0b802cdd57d473bb197d281de8f659/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2015},
ee = {https://doi.org/10.1109/3DIC.2015.7334577},
interhash = {eac08f611dae1024a8c57dc56255b446},
intrahash = {ed0b802cdd57d473bb197d281de8f659},
isbn = {978-1-4673-9385-0},
keywords = {dblp},
pages = {TS7.3.1-TS7.3.5},
publisher = {IEEE},
timestamp = {2019-10-17T15:31:37.000+0200},
title = {High productivity thermal compression bonding for 3D-IC.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#AsahiMNMA15},
year = 2015
}