%0 Conference Paper %1 conf/memsys/ZhuWLZ16 %A Zhu, Yuxiong %A Wang, Borui %A Li, Dong %A Zhao, Jishen %B MEMSYS %D 2016 %E Jacob, Bruce L. %I ACM %K dblp %P 402-414 %T Integrated Thermal Analysis for Processing In Die-Stacking Memory. %U http://dblp.uni-trier.de/db/conf/memsys/memsys2016.html#ZhuWLZ16 %@ 978-1-4503-4305-3

@inproceedings{conf/memsys/ZhuWLZ16, added-at = {2023-03-02T00:00:00.000+0100}, author = {Zhu, Yuxiong and Wang, Borui and Li, Dong and Zhao, Jishen}, biburl = {https://www.bibsonomy.org/bibtex/230a691d11b10468b1b65eb68655b13e0/dblp}, booktitle = {MEMSYS}, crossref = {conf/memsys/2016}, editor = {Jacob, Bruce L.}, ee = {https://doi.org/10.1145/2989081.2989093}, interhash = {efa3778d71305d5ed3cd1d6d6b996f6b}, intrahash = {30a691d11b10468b1b65eb68655b13e0}, isbn = {978-1-4503-4305-3}, keywords = {dblp}, pages = {402-414}, publisher = {ACM}, timestamp = {2024-04-10T20:27:58.000+0200}, title = {Integrated Thermal Analysis for Processing In Die-Stacking Memory.}, url = {http://dblp.uni-trier.de/db/conf/memsys/memsys2016.html#ZhuWLZ16}, year = 2016 }