%0 Conference Paper %1 conf/cicc/AyaziWJGDL19 %A Ayazi, Farrokh %A Wen, Haoran %A Jeong, Yaesuk %A Gupta, Pranav %A Daruwalla, Anosh %A Liu, Chang-Shun %B CICC %D 2019 %I IEEE %K dblp %P 1-8 %T High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging. %U http://dblp.uni-trier.de/db/conf/cicc/cicc2019.html#AyaziWJGDL19 %@ 978-1-5386-9395-7

@inproceedings{conf/cicc/AyaziWJGDL19, added-at = {2022-10-02T00:00:00.000+0200}, author = {Ayazi, Farrokh and Wen, Haoran and Jeong, Yaesuk and Gupta, Pranav and Daruwalla, Anosh and Liu, Chang-Shun}, biburl = {https://www.bibsonomy.org/bibtex/2ad8af52bf1af735c971d0dce033b5002/dblp}, booktitle = {CICC}, crossref = {conf/cicc/2019}, ee = {https://doi.org/10.1109/CICC.2019.8780183}, interhash = {f82d91559869b7db52c1e06f3c73efe6}, intrahash = {ad8af52bf1af735c971d0dce033b5002}, isbn = {978-1-5386-9395-7}, keywords = {dblp}, pages = {1-8}, publisher = {IEEE}, timestamp = {2024-04-10T22:10:48.000+0200}, title = {High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging.}, url = {http://dblp.uni-trier.de/db/conf/cicc/cicc2019.html#AyaziWJGDL19}, year = 2019 }