%0 Journal Article %1 journals/et/BackesMSWG12 %A Backes, Benjamin %A McDonough, Colin %A Smith, Larry %A Wang, Wei %A Geer, Robert E. %D 2012 %J J. Electron. Test. %K dblp %N 1 %P 53-62 %T Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits. %U http://dblp.uni-trier.de/db/journals/et/et28.html#BackesMSWG12 %V 28

@article{journals/et/BackesMSWG12, added-at = {2020-09-11T00:00:00.000+0200}, author = {Backes, Benjamin and McDonough, Colin and Smith, Larry and Wang, Wei and Geer, Robert E.}, biburl = {https://www.bibsonomy.org/bibtex/24898466cfa24fbeef8d5de111a6a19c0/dblp}, ee = {https://doi.org/10.1007/s10836-011-5242-7}, interhash = {face367436db6e4a2271d316a849307b}, intrahash = {4898466cfa24fbeef8d5de111a6a19c0}, journal = {J. Electron. Test.}, keywords = {dblp}, number = 1, pages = {53-62}, timestamp = {2020-09-12T11:41:23.000+0200}, title = {Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits.}, url = {http://dblp.uni-trier.de/db/journals/et/et28.html#BackesMSWG12}, volume = 28, year = 2012 }